List of Intel Core mobile processors

The following is a list of Intel Core mobile processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture; as well as its Core 2– (Solo/Duo/Quad/Extreme), Core i3–, Core i5–, Core i7–, Core i9–, Core M– (m3/m5/m7), Core 3–, Core 5–, Core 7–, and Core 9–branded processors.

Core

Yonah

Core 2

"Merom-L" (65 nm)

"Merom", "Merom-2M" (standard-voltage, 65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2) Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710. Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed. Die size: 143 mm2 (Merom), 111 mm2 (Merom-2M) Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M) All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings Die size: 143 mm2 Steppings: B2, E1, G0, G2

"Merom-2M" (ultra-low-voltage, 65 nm)

"Merom XE" (65 nm)

These models feature an unlocked clock multiplier All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s. Die size: 143 mm2 Steppings: E1, G0

"Penryn-L" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA) Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed. Die size: 82 mm2 228 million transistors Package size: 22 mm × 22 mm Steppings: M0, R0

"Penryn" (Apple iMac specific, 45 nm)

Die size: 107 mm2 The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple. Steppings: C0, E0

"Penryn", "Penryn-3M" (standard-voltage, 45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA) T6570, T6670, all T8xxx and T9xxx models support Intel VT-x All T9xxx models support Trusted Execution Technology (TXT) T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled. Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s. Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M) Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)

"Penryn", "Penryn-3M" (medium-voltage, 45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450), Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA) Select Apple subsets of P7000 series processors support Intel VT-x. Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s. Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M) Package size: 35 mm × 35 mm Transistors: 410 million Steppings: (Core microarchitecture 45nm steppings) C0, E0 (Penryn) M0, R0 (Penryn-3M) stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

"Penryn" (medium-voltage, 45 nm, Small Form Factor)

"Penryn" (low-voltage, 45 nm, Small Form Factor)

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA) Die size: 107 mm2 Package size: 22 mm × 22 mm Steppings: M0, R0

"Penryn XE" (45 nm)

These models feature an unlocked clock multiplier All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s. Die size: 107 mm2 Steppings: C0, E0

"Penryn QC" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed. Die size: 2 × 107 mm2 Steppings: E0

"Penryn QC XE" (45 nm)

This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor. All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed. Package size: 35 mm × 35 mm Die size: 2 × 107 mm2 Steppings: E0

Core i (1st gen)

Clarksfield

Common features: Socket: G1. All the CPUs support dual-channel DDR3-1333 RAM. All CPU models provide 16 lanes of PCIe 2.0. All CPUs feature a DMI 1.0 bus to the chipset (PCH). No integrated graphics. L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 45 nm. XM-suffix processors have an unlocked multiplier and can be overclocked.

Processorbranding Model Cores(Threads) Clock rate (GHz) SmartCache TDP Releasedate Base Turbo Core i7 940XM 4 (8) 2.13 3.33 8 MB 55 W 920XM 2.00 3.20 840QM 1.86 45 W 820QM 1.73 3.06 740QM 2.93 6 MB 720QM 1.60 2.80

Arrandale

Common features: Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1. All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds. All CPU models provide 16 lanes of PCIe 2.0. All CPUs feature a DMI 1.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 680UM 2 (4) 1.46 2.53 HD Graphics 166–500 4 MB 18 W 660LM2.263.06266–56625 W 660UM1.332.40166–50018 W 640M2.803.46500–76635 W 640LM2.132.93266–56625 W 640UM1.202.27166–50018 W 620M2.663.33500–76635 W 620LM2.002.80266–56625 W 620UM1.062.13166–50018 WCore i5 580M2.663.33500–7663 MB35 W 560M3.20 560UM1.332.13166–50018 W 540M2.533.07500–76635 W 540UM1.202.00166–50018 W 520M2.402.93500–76635 W 520UM1.071.87166–50018 W 480M2.662.93500–76635 W 470UM1.331.86166–50018 W 460M2.532.80500–76635 W 450M2.402.66 430M2.262.53 430UM1.201.73166–50018 W Core i3 390M2.66 rowspan="7" 500–66735 W 380M2.53 380UM1.33166–50018 W 370M2.40500–66735 W 350M2.26 330M2.13 330UM1.20166–50018 W

Core i (2nd gen)

Sandy Bridge-M

Common features: Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models). All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds. All CPU models provide 16 lanes of PCIe 2.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm. XM-suffix models have an unlocked multiplier and can be overclocked.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 2960XM 4 (8) 2.7 3.7 HD 3000 650–1300 8 MB 55 W 2920XM2.53.5 2860QM3.645 W 2820QM2.33.4 2760QM2.43.56 MB 2720QM2.23.3 2675QM3.1650–1200 2670QM650–1100 2635QM2.02.9650–1200 2630QM650–1100 2677M2 (4)1.82.9350–12004 MB17 W 2657M1.62.7350–1000 2640M2.83.5650–130035 W 2649M2.33.2500–110025 W 2637M1.72.8350–120017 W 2620M2.73.4650–130035 W 2629M2.13.0500–110025 W 2617M1.52.6350–95017 WCore i5 2557M1.72.7350–12003 MB 2540M2.63.3650–130035 W 2537M1.42.3350–90017 W 2520M2.53.2650–130035 W 2467M1.62.3350–115017 W 2450M2.53.1650–130035 W 2435M2.43.0 2430M650–1200 2415M2.32.9650–1300Q1 2011 2410M650–1200 Core i3 2370M2.4 rowspan="14" 650–1150 2377M1.5350–100017 W 2375MQ1 2013 2367M1.4 2365M 2350M2.3650–115035 W 2357M1.3350–95017 W 2348M2.3650–115035 W 2332M2.2650–1100 2330M 2328M 2312M2.1Q2 2011 2310M 2308MQ3 2012

Core i (3rd gen)

Ivy Bridge

Common features: Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models). All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.

List of Intel Core mobile processors

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