The following is a list of Intel Core embedded processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture; as well as its Core 2– (Solo/Duo/Quad/Extreme), Core i3–, Core i5–, Core i7–, Core i9–, Core M– (m3/m5/m7), Core 3–, Core 5–, Core 7–, and Core 9–branded processors.

Core i (1st gen)

Arrandale

Common features: Socket: BGA 1288. All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds. All CPUs except for the i3-330E support ECC memory. All CPU models provide 16 lanes of PCIe 2.0. All CPUs feature a DMI 1.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 660UE 2 (4) 1.33 2.40 HD Graphics 166–500 4 MB 18 W 620LE 2.00 2.80 266–566 25 W 620UE 1.06 2.13 166–500 18 W 610E 2.53 3.20 500–766 35 W Core i5 520E 2.40 2.93 3 MB Core i3 330E 2.13 500–666

Core i (2nd gen)

Sandy Bridge-DT

The following models from the Sandy Bridge desktop range are available as embedded processors: Core i7-2600 Core i5-2400 Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Sandy Bridge-M

Common features: Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models). All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2710QE and above support up to 1600 MT/s speeds. All CPUs except for the i3-2330E, i5-2510E & i7-2710QE support ECC memory. All CPU models provide 16 lanes of PCIe 2.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 2715QE 4 (8) 2.1 3.0 HD 3000 650–1200 6 MB 45 W 2710QE 2655LE2 (4)2.22.9650–10004 MB25 W 2610UE1.52.4350–85017 WCore i5 2515E2.53.1650–11003 MB35 W 2510ECore i3 2340UE1.3 rowspan="3" 350–80017 W 2330E2.2650–105035 W 2310E2.1

Gladden

Common features: Socket: BGA 1284. All the CPUs support dual-channel DDR3-1333 RAM. All CPU models provide 16 lanes of PCIe 2.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). No integrated graphics. L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) SmartCache TDP Releasedate Base Turbo Core i3 2115C 2 (4) 2.0 3 MB 25 W Q2 2012

Core i (3rd gen)

Ivy Bridge-DT

The following models from the Ivy Bridge desktop range are available as embedded processors: Core i7-3770 Core i5-3550S Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Ivy Bridge-M

Common features: Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME). All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed. All CPUs except the i7-3610QE support ECC memory, with ME-suffixed models only supporting it on their BGA-socketed variants. i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 3615QE 4 (8) 2.3 3.3 HD 4000 650–1000 6 MB 45 W 3610QE 3612QE2.13.135 W 3555LE2 (4)2.53.2550–10004 MB25 W 3517UE1.72.8350–100017 WCore i5 3610ME2.73.3650–9503 MB35 WCore i3 3217UE1.6 rowspan="2" 350–90017 W 3120ME2.4650–90035 W

Gladden

Common features: Socket: BGA 1284. All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM. All CPU models provide 20 lanes of PCIe 3.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). No integrated graphics. L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) SmartCache TDP Releasedate Base Turbo Core i3 3115C 2 (4) 2.5 4 MB 25 W Q3 2013

Core i (4th gen)

Haswell-DT

Common features: Socket: LGA 1150. All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed. All CPUs except for the i7-4770TE and embedded variants of desktop models support ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 4770TE 4 (8) 2.3 3.3 HD 4600 350–1000 8 MB 45 W Core i5 4570TE 2 (4) 2.7 4 MB 35 W Core i3 4340TE 2.6 rowspan=2 4330TE 2.4

The following models from the Haswell-DT desktop range are also available as embedded processors: Core i7-4790S Core i7-4770S Core i5-4590S Core i5-4590T Core i5-4570S Core i3-4360 Core i3-4350T Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Haswell-H

Common features: Socket: BGA 1364. All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed. All CPUs support ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache. Fabrication process: 22 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 4860EQ 4 (8) 1.8 3.2 Iris Pro 5200 750–1000 6 MB 47 W 4850EQ1.63.2650–1000 4701EQ2.43.4HD 4600400–1000Q3 2013 4700EQ 4700EC2.7 rowspan="2" colspan="2" rowspan="2" 8 MB43 W 4702EC2.027 WCore i5 4422E2 (4)1.82.9HD 4600400–9003 MB25 W 4410E2.9 400–100037 W 4400E2.73.3400–1000 4402E1.62.7400–90025 W 4402EC2.5 rowspan="5" colspan="2" 4 MB27 W Core i3 4110E2.6HD 4600400–9003 MB37 W 4112E1.825 W 4100E2.437 W 4102E1.625 W

Core i (5th gen)

Broadwell-H

Common features: Socket: BGA 1364. All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed. All CPUs support ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache. Fabrication process: 14 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 5850EQ 4 (8) 2.7 3.4 Iris Pro 6200 300–1000 6 MB 47 W 5700EQ 2.6 HD 5600

Core i (6th gen)

Skylake-S

Common features: Socket: LGA 1151. All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM. The i3-6100TE supports ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 6700TE 4 (8) 2.4 3.4 HD 530 350–1000 8 MB 35 W Core i5 6500TE 4 (4) 2.3 3.3 6 MB Core i3 6100TE 2 (4) 2.7 4 MB Q4 2015

Skylake-H

Common features: Socket: BGA 1440. All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM. All i3 models support ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache. Fabrication process: 14 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 6820EQ 4 (8) 2.8 3.5 HD 530 350–1000 8 MB 45 W 6822EQ 2.0 2.8 25 W Core i5 6440EQ 4 (4) 2.7 3.4 6 MB 45 W 6442EQ 1.9 2.7 25 W Core i3 6100E 2 (4) 2.7 rowspan=2 350–950 3 MB 35 W 6102E 1.9 25 W

Core i (7th gen)

Kaby Lake-S

Common features: Socket: LGA 1151. All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM. All CPUs support ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i3 7101E 2 (4) 3.9 rowspan=2 HD 610 350–1100 3 MB 54 W 7101TE 3.4 35 W

Kaby Lake-H

Common features: Socket: BGA 1440. All the CPUs support dual-channel DDR4-2400 RAM. All i3 models support ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 7820EQ 4 (8) 3.0 3.7 HD 630 350–1000 8 MB 45 W Core i5 7440EQ 4 (4) 2.9 3.6 6 MB 7442EQ 2.1 2.9 25 W Core i3 7100E 2 (4) 2.9 rowspan=2 350–950 3 MB 35 W 7102E 2.1 25 W

Core i (8th gen)

Whiskey Lake-U

Common features: Socket: BGA 1528. All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 8665UE 4 (8) 1.7 4.4 UHD 620 300–1150 8 MB 15 W Core i5 8365UE 1.6 4.1 300–1050 6 MB Core i3 8145UE 2 (4) 2.2 3.9 300–1000 4 MB

Core i (9th gen)

Coffee Lake-R

Common features: Socket: LGA 1151-2. All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds. All i3 models support ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 9700E 8 (8) 2.6 4.4 UHD 630 350–1150 12 MB 65 W 9700TE 1.8 3.8 35 W Core i5 9500E 6 (6) 3.0 4.2 350–1100 9 MB 65 W 9500TE 2.2 3.6 35 W Core i3 9100E 4 (4) 3.1 3.7 350–1050 6 MB 65 W 9100TE 2.2 3.2 35 W

Coffee Lake-H (refresh)

Common features: Socket: BGA 1440. All the CPUs support dual-channel DDR4-2666 RAM. The i3-9100HL supports ECC memory. All CPU models provide 16 lanes of PCIe 3.0. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache: 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm.

Processorbranding Model Cores(Threads) Clock rate (GHz) Integrated GPU SmartCache TDP Releasedate Base Turbo Model Clock (MHz) Core i7 9850HE 6 (12) 2.7 4.4 UHD 630 350–1150 9 MB 45 W 9850HL 1.9 4.1 25 W Core i3 9100HL 4 (4) 1.6 2.9 350–1100 6 MB

Core i (10th gen)

Comet Lake-S

Common features: Socket: LGA 1200.