LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors based on Alder Lake and Raptor Lake, which was first released in November 2021.
LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5) and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs.
The LGA 1700 socket and processor package form factor is also used on Zhaoxin's KX-7000 series of desktop processors, though they are electrically and logically incompatible with motherboards designed for Intel processors and vice-versa; the use of the form factor is presumably to ensure broad compatibility with existing cooler solutions and reduce production costs.
Heatsink design Since the introduction of land grid array (LGA)-based sockets in the consumer hardware space in 2004, the thermal solution hole pattern (the distance between centers of the screw-holes for the heatsink) has changed three times for Intel's mainstream platforms: For LGA 775, it is 72 mm × 72 mm For LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200 it is 75 mm × 75 mm For LGA 1700, LGA 1851, it is 78 mm × 78 mm
While some motherboards do offer additional mounting holes for using older coolers, e.g. for using an LGA115x cooler on an LGA1700 motherboard, differences in Z-height and the mounting pressure will result in worse than expected cooling performance. For best results it is recommended to either change the cooling solution to a model certified for this platform or request an updated mounting-kit for one of the higher-end solutions on the market. For heatsinks to be interchangeable, not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the IHS and the static total compressive minimum need to match.
Issues Even though some CPU cooler manufacturers are providing adapter kits (usually in the form of different screws) to go with existing LGA115x and LGA1200 retention brackets, there have been reports of the CPU bending or bowing due to uneven mounting pressure from the LGA 1700 integrated loading mechanism (ILM). This leads to the CPU having reduced contact with the cooler plate, which in turn leads to increased temperatures. LGA 1700 contact frames to replace the stock ILM have been released by Thermal Grizzly and Thermalright to ensure even CPU mounting pressure and cooler contact.
Maximum RAM Initially motherboards based on Alder Lake and Raptor Lake chipsets supported 32 GB memory modules but most known OEMs in 2023 updated their UEFI to support 48 GB modules and in December 2023 support for 64 GB modules started to roll out first by MSI and ASRock. Users are advised to consult with their motherboards web support pages to check what memory modules can be installed.
Alder Lake chipsets (600 series)
H610 B660 H670 Q670Intel Q670 Chipset Z690 W680Intel W680 Chipset Overclocking colspan="2" Bus interface DMI 4.0 ×4 DMI 4.0 ×8 CPU support Alder LakeRaptor Lake (a BIOS update may be required) Memory capacity Up to 64/128 GB Up to 128/256 GB Maximum DIMM slots 2 4 ECC memory colspan="5" Maximum USB 2.0 ports 10 12 14 USB 3.2 ports configuration Up to 4 Up to 6 Up to 8 Up to 10 Gen 2 Up to 2 Up to 4 Up to 8 Up to 10 Up to 2 Up to 4 Maximum SATA 3.0 ports 4 8 Processor PCI Express configuration 5.0 1×16 1×16 or 2×8 4.0 1×4 PCH PCI Express configuration 4.0 6 12 3.0 8 12 16 Independent display support (digital ports/pipes) 3 4 Integrated wireless colspan="6" PCIe RAID support colspan="2" colspan="4" SATA RAID support colspan="5" Intel Optane memory support colspan="5" Intel Smart SoundSmart sound technology technology colspan="6" Intel Active Management, Trusted Execution and vPro technology colspan="3" Chipset TDP 6 W Release date Q1 2022 Q4 2021 Q2 2022
Raptor Lake chipsets (700 series)
B760 H770 Z790 Overclocking Bus InterfaceDMI 4.0 ×4DMI 4.0 ×8 CPU supportAlder Lake and Raptor Lake Memory capacityUp to 128/256 GB Maximum DIMM slots4 Maximum USB 2.0 ports1214 USB 3.2 ports configuration Up to 6Up to 8 Up to 10 Gen 2 Up to 4 Up to 10 Up to 2 Up to 5 Maximum SATA 3.0 ports48 Processor PCI Express configuration 5.01x161×16 or 2×8 4.0 1x4 PCH PCI Express configuration 4.01016 20 3.048 Independent display support (digital ports/pipes)4 Integrated wireless colspan="3" PCIe RAID support colspan="2" SATA RAID support colspan="3" Intel Optane memory support colspan="3" Intel Smart Sound technology colspan="3" Intel Active Management, Trusted Execution and vPro technology colspan="3" Chipset TDP 6 W Release date Q1 2023Q4 2022
See also List of Intel microprocessors List of Intel chipsets
References