LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.

LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips.

Full support of Windows on LGA 1200 platform starts on Windows 10. A previously released and enthusiast-created modification disabled the Windows Update check and allowed Windows versions down to Windows 7 to continue to work on that platform. Like its preceding sockets, official Windows XP support is limited to selected CPUs, chipsets and only for embedded and industrial systems. ASRock, Asus, Biostar, Gigabyte and MSI have confirmed their motherboards based on the Intel Z490 chipset support the 11th generation Intel Rocket Lake desktop CPUs. Full PCIe 4.0 support is confirmed for selected brands. ASUS did not include support to PCIe 4.0 on M.2, hindering support for PCIe gen 4.0 NVMe SSDs.

Heatsink

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable.

Comet Lake chipsets (400 series)

Memory support configuration common for all chipsets: Dual channel DDR4-2666 or DDR4-2933

H410 B460 H470 Q470 Z490 W480 Overclocking colspan="3" Bus InterfaceDMI 3.0 x4CPU supportComet Lake-S onlyComet Lake-S / Rocket Lake (a BIOS update is required)Memory support Up to 64 GBUp to 128 GB Maximum DIMM slots 2 4 ECC memory colspan="5" Maximum USB 2.0 ports 10 12 14 USB 3.2 ports configuration Gen 1x1 Up to 4 Up to 8 Up to 10 Gen 2x1 N/A Up to 4 Up to 6 Up to 8 Maximum SATA 3.0 ports 4 6 8 Processor PCI Express v3.0 configuration 1x16 1x16 or 2x8 or 1x8+2x4 PCH PCI Express configuration 6 16 20 24 Independent Display Support (digital ports/pipes) 2 3 Integrated Wireless (802.11ax) colspan="2" colspan="4" SATA RAID 0/1/5/10 support rowspan="3" colspan="5" rowspan="3" Intel Optane Memory Support Intel Smart Sound Technology Intel Active Management, Trusted Execution and vPro Technology colspan="3" Chipset TDP 6W Chipset lithography 22 nm 14 nm Release date Q2 2020

Rocket Lake chipsets (500 series) Memory support configuration common for all chipsets (except W580): Dual channel DDR4-3200 for 11th generation Rocket Lake Core i9/i7/i5 CPUs DDR4-2933 for 10th generation Comet Lake Core i9/i7 CPUs DDR4-2666 for all other CPUs Up to 128 GB using 32 GB modules; maximum 64 GB for the H510 chipset

W580 based motherboards support DDR4-3200 RAM in dual channel mode.

H510 B560 H570 Q570 Z590 W580 Overclocking colspan="2" Bus Interface DMI 3.0 x4 DMI 3.0 x8 (runs in x4 mode for Comet Lake-S CPUs) CPU support Comet Lake-S / Rocket Lake Rocket Lake Maximum DIMM slots 2 4 ECC memory colspan="5" Maximum USB 2.0 ports 10 12 14 USB 3.2 ports configuration Gen 1x1 Up to 4 Up to 6 Up to 8 Up to 10 Up to 10 Gen 2 x1 rowspan="2" Up to 4 Up to 8 x2 Up to 2 Up to 3 Maximum SATA 3.0 ports 4 6 8 Processor PCI Express v4.0 configuration 1x16 1x16 + 1x4 1x16 + 1x4 or 2x8 + 1x4 or 1x8 + 3x4 PCH PCI Express configuration 6 12 20 24 Independent Display Support (digital ports/pipes) 2 3 Integrated Wireless (802.11ax) colspan="6" PCIe RAID 0/1/5/10 support colspan="2" colspan="4" SATA RAID 0/1/5/10 support colspan="2" colspan="4" Intel Optane Memory Support rowspan="2" colspan="5" rowspan="2" Intel Smart Sound Technology Intel Active Management, Trusted Execution and vPro Technology colspan="3" Chipset TDP 6W Chipset lithography 14 nm Release date Q1 2021 Q2 2021 Q1 2021 Q2 2021

See also List of Intel microprocessors List of Intel chipsets

References