List of AMD processors with 3D graphics

This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit (iGPU), including those under the AMD APU (Accelerated Processing Unit) product series.

Features overview

Graphics API overview

Desktop processors with 3D graphics APU or Radeon Graphics branded Lynx: "Llano" (2011) Socket FM1 CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache L1 cache: 64 KB Data per core and 64 KB Instruction cache per core L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics. List of embedded GPU's Support for up to four DIMMs of up to DDR3-1866 memory Fabrication 32 nm on GlobalFoundries SOI process; Die size: , with 1.178 billion transistors 5 GT/s UMI Integrated PCIe 2.0 controller Select models support Turbo Core technology for faster CPU operation when the thermal specification permits Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series Model Released Fab Step. CPU GPU DDR3memorysupport TDP(W) Box number Part number Cores(threads) Clock rate (GHz) Cache Model Config Clock(MHz) Processingpower(GFLOPS) Base Boost L1 L2 201232 nm SOI LN-B0 2 (2) 2.5 rowspan=12 64 KB inst.64 KB dataper core 2×512 KB rowspan=8 colspan=4 1600 65 SD198XOJGXBOX SD198XOJZ22GX 2012 2.8 AD221XOJGXBOX AD221XOJZ22GX 2012 4 (4) 2.6 4×1 MB 1866 AD631XOJGXBOX AD631XOJZ43GX 100 AD631XOJGXBOX AD631XWNZ43GX 2.7 65 AD638XOJGXBOX AD638XOJZ43GX 2.8 100 AD641XWNGXBOX AD641XWNZ43GX 3.0 AD651XWNGXBOX AD651XWNZ43GX 2012 AD651KWNGXBOX AD651KWNZ43GX 2011 2 (2) 2.4 2×512 KB HD 6370D 160:8:4 443 141.7 1600 65 ED3200OJGXBOX ED3200OJZ22GXED3200OJZ22HX 2.5 HD 6410D AD3300OJGXBOXAD3300OJHXBOX AD3300OJZ22GXAD3300OJZ22HX 2.7 600 192 AD3400OJGXBOXAD3400OJHXBOX AD3400OJZ22GXAD3400OJZ22HX A4-3420 2.8 AD3420OJZ22HX 3 (3) 2.1 2.4 3×1 MB HD 6530D 320:16:8 443 283.5 1866 AD3500OJGXBOX AD3500OJZ33GX 4 (4) 4×1 MB AD3600OJGXBOX AD3600OJZ43GX 2.2 2.5 AD3620OJGXBOX AD3620OJZ43GX 2.6 rowspan=2 100 AD3650WNGXBOX AD3650WNZ43GX 2.7 AD3670WNGXBOX AD3670WNZ43GX 2.4 2.7 HD 6550D 400:20:8 600 480 65 AD3800OJGXBOX AD3800OJZ43GX 2.5 2.8 AD3820OJGXBOX AD3820OJZ43GX 2.9 rowspan=2 100 AD3850WNGXBOX AD3850WNZ43GX 3.0 AD3870WNGXBOX AD3870WNZ43GX

Virgo: "Trinity" (2012) Fabrication 32 nm on GlobalFoundries SOI process Socket FM2 CPU: Piledriver L1 Cache: 16 KB Data per core and 64 KB Instructions per module GPU TeraScale 3 (VLIW4) Die Size: , 1.303 Billion transistors Support for up to four DIMMs of up to DDR3-1866 memory 5 GT/s UMI GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3 Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM Sempron and Athlon models exclude integrated graphics Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card. However, it has been found that this does not always improve 3D accelerated graphics performance. Model Released Fab Step. CPU GPU DDR3memorysupport TDP(W) Box number Part number [Modules/FPUs]Cores/threads Clock rate (GHz) Cache Model Config Clock(MHz) Processingpower(GFLOPS) Base Boost L1 L2 Sempron X2 240 32 nm TN-A1 2 2.9 3.3 64 KB inst.per module16 KB dataper core 1 MB rowspan=5 colspan=4 1600 65 SD240XOKA23HJ Athlon X2 340 Oct 2012 3.2 3.6 AD340XOKA23HJ Athlon X4 730 Oct 1, 2012 4 2.8 3.22×2 MB1866 AD730XOKA44HJ Athlon X4 740 Oct 2012 3.2 3.7 AD740XOKHJBOX AD740XOKA44HJ 3.4 4.0 100 AD750KWOHJBOX AD750KWOA44HJ Aug 7, 2012 3.4 4.0 FirePro 384:24:86 CU 760 583.6 65 AWA300OKA44HJ 3.8 4.2 800 614.4 100 AWA320WOA44HJ Oct 1, 2012 2 3.4 3.6 1 MB HD 7480D 128:8:42 CU 723 185 1600 65 AD5300OKHJBOX AD5300OKA23HJ Oct 2012 AD530BOKA23HJ Oct 1, 2012 3.6 3.8 HD 7540D 192:12:43 CU 760 291.8 1866 AD540KOKHJBOX AD540KOKA23HJ Oct 2012 AD540BOKA23HJ Oct 1, 2012 4 3.2 3.7 2×2 MB HD 7560D 256:16:84 CU 760 389.1 AD5500OKHJBOX AD5500OKA44HJ Oct 2012 AD550BOKA44HJ Oct 1, 2012 3.6 3.9 100 AD560KWOHJBOX AD560KWOA44HJ 3.4 4.0 HD 7660D 384:24:86 CU 760 583.6 65 AD5700OKHJBOX AD5700OKA44HJ 3.8 4.2 800 614.4 100 AD580KWOHJBOX AD580KWOA44HJ Oct 2012 AD580BWOA44HJ

"Richland" (2013) Fabrication 32 nm on GlobalFoundries SOI process Socket FM2 Two or four CPU cores based on the Piledriver microarchitecture Die Size: , 1.303 Billion transistors L1 Cache: 16 KB Data per core and 64 KB Instructions per module MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow! GPU TeraScale 3 architecture HD Media Accelerator, AMD Hybrid Graphics

Model Released Fab Step. CPU GPU DDR3memorysupport TDP(W) Box number Part number [Modules/FPUs]Cores/threads Clock rate (GHz) Cache Model Config Clock(MHz) Processingpower(GFLOPS) Base Boost L1 L2 Sempron X2 250 32 nm RL-A1 2 3.2 3.6 64 KB inst.per module16 KB dataper core 1 MB rowspan=6 colspan=4 65 SD250XOKA23HL Athlon X2 350 3.5 3.9 1866 AD350XOKA23HL Athlon X2 370K Jun 2013 4.0 4.2 AD370KOKHLBOX AD370KOKA23HL Athlon X4 750 Oct 2013 4 3.4 4.0 2×2 MB AD750XOKA44HL Athlon X4 760K Jun 2013 3.8 4.1 100 AD760KWOHLBOX AD760KWOA44HL FX-670K Mar 2014 (OEM) 3.7 4.3 65 FD670KOKA44HL A4-4000 May 2013 2 3.0 3.2 1 MB HD 7480D 128:8:42 CU 720 184.3 1333 AD4000OKHLBOX AD4000OKA23HL A4-4020 Jan 2014 3.2 3.4 AD4020OKHLBOX AD4020OKA23HL A4-6300 Jul 2013 3.7 3.9 HD 8370D 760 194.5 1600 AD6300OKHLBOX AD6300OKA23HL A4-6300B AD630BOKA23HL A4-6320 Dec 2013 3.8 4.0 AD6320OKHLBOX AD6320OKA23HL A4-6320B Mar 2014 AD632BOKA23HL A4-7300 Aug 2014 HD 8470D 192:12:43 CU 800 307.2 AD7300OKA23HL A4 Pro-7300B AD730BOKA23HL A6-6400B Jun 4, 2013 3.9 4.1 1866 AD640BOKA23HL A6-6400K AD640KOKHLBOX AD640KOKA23HL A6-6420B Jan 2014 4.0 4.2 AD642BOKA23HL A6-6420K AD642KOKHLBOX AD642KOKA23HL A8-6500T Sep 18, 2013 4 2.1 3.1 2×2 MB HD 8550D 256:16:84 CU 720 368.6 45 AD650TYHHLBOX AD650TYHA44HL A8-6500 Jun 4, 2013 3.5 4.1 HD 8570D 800 409.6 65 AD6500OKHLBOX AD6500OKA44HL A8-6500B AD650BOKA44HL A8-6600K 3.9 4.2 844 432.1 100 AD660KWOHLBOX AD660KWOA44HL A10-6700T Sep 18, 2013 2.5 3.5 HD 8650D 384:24:86 CU 720 552.9 45 AD670TYHHLBOX AD670TYHA44HL A10-6700 Jun 4, 2013 3.7 4.3 HD 8670D 844 648.1 65 AD6700OKHLBOX AD6700OKA44HL A10-6790B Oct 29, 2013 4.0 100 AD679KWOHLBOX AD679KWOA44HL A10-6790K Oct 28, 2013 AD679BWOA44HL A10-6800K Jun 4, 2013 4.1 4.4 2133 AD680KWOHLBOX AD680KWOA44HL A10-6800BAD680BWOA44HL

"Kabini" (2013, SoC) Fabrication 28 nm by GlobalFoundries Socket AM1, aka Socket FS1b (AM1 platform) 2 to 4 CPU Cores (Jaguar (microarchitecture)) L1 Cache: 32 KB Data per core and 32 KB Instructions per core MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III (6 Gb/s) controllers GPU based on Graphics Core Next (GCN) Model Released Fab Step. CPU GPU DDR3memorysupport TDP(W) Box number Part number Cores(threads) Clock rate (GHz) Cache Model Config Clock(MHz) Processingpower(GFLOPS) Base Boost L1 L2 28 nm KB-A1 4 (4) 2.00 rowspan="7" 32 KB inst.32 KB dataper core 2 MB rowspan="2" colspan="4" 1600single-channel 25 AD530XJAH44HM 2.20 AD550XJAH44HM Apr 9, 2014 2 (2) 1.45 1 MB R3 (HD 8240) 128:8:42 CU 400 102.4 1333single-channel SD2650JAHMBOX SD2650JAH23HM 4 (4) 1.30 2 MB R3 (HD 8280) 450 115.2 1600single-channel SD3850JAHMBOX SD3850JAH44HM 1.60 R3 (HD 8400) 600 153.6 AD5150JAHMBOX AD5150JAH44HM 2.05 AD5350JAHMBOX AD5350JAH44HM Feb 2016 2.20 AD5370JAH44HM

"Kaveri" (2014) & "Godavari" (2015) Fabrication 28 nm by GlobalFoundries. Socket FM2+, support for PCIe 3.0. Two or four CPU cores based on the Steamroller microarchitecture. Kaveri refresh models have codename Godavari. Die Size: , 2.41 Billion transistors. L1 Cache: 16 KB Data per core and 96 KB Instructions per module. MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core Three to eight Compute Units (CUs) based on GCN 2nd gen microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs). Heterogeneous System Architecture-enabled zero-copy through pointer passing. SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio. Dual-channel (2× 64 Bit) DDR3 memory controller. Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions in select APU models, except the Performance APU models. Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card. Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support. Model Released Fab Step. CPU GPU DDR3memorysupport TDP(W) Box number Part number [Modules/FPUs]Cores/threads Clock rate (GHz) Cache Model Config Clock(MHz) Processingpower(GFLOPS) Base Boost L1 L2 Jul 31, 2014 28 nm KV-A1 2 3.5 3.9 96 KB inst.per module16 KB dataper core 1 MB rowspan=8 colspan=4 1866 65 AD450XYBI23JA 2018 4 3.0 3.4 2×2 MB 2133 AD830XYBI44JAAthlon X4 840 Aug 2014 3.1 3.8 AD840XYBJABOX AD840XYBI44JA 2015 GV-A1 3.2 AD835XACI43KA Aug 2014 KV-A1 3.7 4.0 95 AD860KXBJABOXAD860KWOHLBOXAD860KXBJASBX AD860KXBI44JA Dec 2015 GV-A1 3.9 4.1 AD870KXBJCSBX AD870KXBI44JC Mar 1, 2016 4.0 4.2 AD880KXBJCSBX FX-770K Dec 2014 KV-A1 3.5 3.9 65 FD770KYBI44JA Jul 31, 2014 2 3.4 3.8 1 MB R5 192:12:83 CU 514 197.3 1866 AD735BYBI23JA Sep 29, 2015 3.5 3.9 256:16:84 CU 757 387.5 AD835BYBI23JCA6-7400K Jul 31, 2014 3.5 3.9 756 387 AD740KYBJABOX AD740KYBI23JA AD740BYBI23JAA6-7470K Feb 2, 2016 GV-A1 3.7 4.0 800 409.6 2133 AD747KYBJCBOX AD747KYBI23JC Sep 29, 2015 AD855BYBI23JCA8-7500 2014 KV-A1 4 3.0 3.7 2×2 MB R7 384:24:8 6 CU 720 552.9 AD7500YBI44JAA8-7600 Jul 31, 2014 3.1 3.8 AD7600YBJABOX AD7600YBI44JA AD760BYBI44JAA8-7650K Jan 7, 2015 3.3 95 AD765KXBJABOXAD765KXBJASBX AD765KXBI44JAA8-7670K Jul 20, 2015 GV-A1 3.6 3.9 757 581.3 AD767KXBJCSBXAD767KXBJCBOX AD767KXBI44JC Sep 29, 2015 3.2 65 AD865BYBI44JCA10-7700K Jan 14, 2014 KV-A1 3.4 3.8 720 552.9 95 AD770KXBJABOX AD770KXBI44JAA10-7800 Jul 31, 2014 3.5 3.9 512:32:88 CU 737.2 65 AD7800YBJABOX AD7800YBI44JA AD780BYBI44JAA10-7850K Jan 14, 2014 3.7 4.0 95 AD785KXBJABOX AD785KXBI44JA Jul 31, 2014 AD785BXBI44JAA10-7860K Feb 2, 2016 GV-A1 3.6 757 775.1 65 AD786KYBJABOXAD786KYBJCSBX AD786KYBI44JCA10-7870K May 28, 2015 3.9 4.1 866 886.7 95 AD787KXDJCBOXAD787KXDJCSBX AD787KXDI44JCA10-7890K Mar 1, 2016 4.1 4.3 AD789KXDJCHBX AD789KXDI44JC Sep 29, 2015 3.6 4.0 757 775.1 65 AD875BYBI44JC 3.9 4.1 800 819.2 95 AD885BXBI44JC Model Released Fab Step. [Modules/FPUs]Cores/threads Base Boost L1 L2 Model Config Clock(MHz) Processingpower(GFLOPS) DDR3memorysupport TDP(W) Box number Part number Clock rate (GHz) Cache CPU GPU

"Carrizo" (2016) Fabrication: 28 nm by GlobalFoundries Socket FM2+ or AM4, support for PCIe 3.0 Two or four CPU cores based on the Excavator microarchitecture Die size: , 3.1 billion transistors L1 cache: 32 KB data per core and 96 KB instructions per module MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core