LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge (second generation core) and Ivy Bridge (third generation) microarchitectures.
Introduced in 2011, it is the successor of LGA 1156 (known as Socket H) and marked the beginning of UEFI secure boot with support on some versions of later boards and was itself succeeded by LGA 1150 in 2013. Along with selected variations of LGA 2011 socket, Socket G2, BGA 1023, BGA 1224, and BGA 1284 as well as LGA 1356, it is the last Intel socket to fully support Windows XP, Windows Server 2003, Windows Vista, and Windows Server 2008. The last processors supporting this socket ceased production in mid-2015.
LGA 1155 has 1155 protruding pins to make contact with the pads on the processor. The pins are arranged in a 40×40 array with a 24×16 central void and additional 61 omitted pins (two adjoining the central void, six in each of the four corners, and 35 in groups around the perimeter), yielding the 1600 − 384 − 61 = 1155 pin count. Processors for LGA 1155 and LGA 1156 sockets are not compatible with each other since they have different socket notches.
Heatsink The four holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable.
Cooling systems are compatible between LGA 1155 and LGA 1156 sockets, as the processors have the same dimensions, profile and construction, and similar levels of heat production.
Sandy Bridge family of chipsets
Sandy Bridge chipsets, except B65, Q65 and Q67, support both Sandy Bridge and Ivy Bridge CPUs through a BIOS upgrade. With third-party BIOSes like Coreboot, Ivy Bridge processors can be used on those chipsets as well. Processors based on Sandy Bridge officially support up to DDR3-1333 memory, however in practice speeds up to DDR3-2133 have been tested to work successfully.
The H61 chipset only supports one double-sided DIMM memory module (RAM module) per memory-channel and therefore is limited to 16GB instead of the 32GB like the others support. On H61-based motherboards with four DIMM slots, only four single-sided DIMMs can be installed.
Name H61 B65 Q65 Q67 H67 P67 Z68 Overclocking GPU CPU + RAM Allows using built-in GPU with Intel Clear Video Technology colspan=5 Maximum USB 2.0 ports 10 12 14 Maximum SATA ports 2.0 4 3.0 0 12 Main PCIe configuration 1 × PCIe 2.0 ×16 (Some H61 Motherboards Support PCIe 3.0) Secondary PCIe 6 × PCIe 2.0 ×1 8 × PCIe 2.0 ×1 Conventional PCI support colspan="3" colspan="3" Intel Rapid Storage Technology (RAID) colspan="3" colspan="4" Smart Response Technology colspan="6" Ivy Bridge processor support colspan="3" colspan="3" Intel Active Management, Trusted Execution, Anti-Theft, and vPro Technology colspan="3" colspan="3" Release date February 2011 May 2011 January 2011 May 2011 Maximum TDP 6.1 W Chipset lithography 65 nm
Ivy Bridge family of chipsets
All Ivy Bridge chipsets and motherboards support both Sandy Bridge and Ivy Bridge CPUs. Ivy Bridge based processors will officially support up to DDR3-1600, up from DDR3-1333 of Sandy Bridge. Some consumer Ivy Bridge chipsets will also allow overclocking of K-series processors.
Name B75 Q75 Q77 C216 H77 Z75 Z77 Overclocking CPU (Base Clock) + GPU Allows using built-in GPU colspan="7" Intel Clear Video Technology colspan=7 RAID colspan="6" Maximum USB ports 2.0 8 10 3.0 4 Maximum SATA ports 2.0 5 4 3.0 1 2 Main PCIe configuration 1 × PCIe 3.0 ×16 Secondary PCIe 8 × PCIe 2.0 ×1 Conventional PCI colspan="4" colspan="3" Intel Rapid Storage Technology colspan="2" colspan="5" Intel Anti-Theft Technology colspan=7 Smart Response Technology colspan="2" colspan="3" Intel vPro Platform Eligibility colspan="2" colspan="2" colspan="3" Release date April 2012 May 2012 April 2012 Maximum TDP 6.7 W Chipset lithography 65 nm
Notes
References
External links Intel desktop processor integration overview (LGA115x)