Epoxy is the family of basic components or cured end products of epoxy resins, also known as polyepoxides, a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. The IUPAC name for an epoxide group is an oxirane.
Epoxy resins may be reacted (cross-linked) either with themselves through catalytic homopolymerisation, or with a wide range of co-reactants including polyfunctional amines, acids (and acid anhydrides), phenols, alcohols and thiols (sometimes called mercaptans). These co-reactants are often referred to as hardeners or curatives, and the cross-linking reaction is commonly referred to as curing.
Reaction of polyepoxides with themselves or with polyfunctional hardeners forms a thermosetting polymer, often with favorable mechanical properties and high thermal and chemical resistance. Epoxy has a wide range of applications, including metal coatings, composites, use in electronics, electrical components (e.g. for chips on board), LEDs, high-tension electrical insulators, paintbrush manufacturing, fiber-reinforced plastic materials, and adhesives for structural and other purposes.
The health risks associated with exposure to epoxy resin compounds include contact dermatitis and allergic reactions, as well as respiratory problems from breathing vapor and sanding dust, especially from compounds not fully cured.
History
Condensation of epoxides and amines was first reported and patented by Paul Schlack of Germany in 1934.Schlack, P. (1938) "Manufacture of amines of high molecular weight, which are rich in nitrogen". German Patent 676117, Claims of discovery of bisphenol-A-based epoxy resins include Pierre Castan in 1943. Castan's work was licensed by Ciba, Ltd. of Switzerland, which went on to become one of the three major epoxy resin producers worldwide. In 1946, Sylvan Greenlee, working for the Devoe & Raynolds Company (now part of Hexion Inc.), patented resin derived from bisphenol-A and epichlorohydrin.
Chemistry Manufacture
Most of the commercially used epoxy monomers are produced by the reaction of a compound with acidic hydroxy groups and epichlorohydrin. First a hydroxy group reacts in a coupling reaction with epichlorohydrin, followed by dehydrohalogenation. Epoxy resins produced from such epoxy monomers are called glycidyl-based epoxy resins. The hydroxy group may be derived from aliphatic diols, polyols (polyether polyols), phenolic compounds or dicarboxylic acids. Phenols can be compounds such as bisphenol A and novolak. Polyols can be compounds such as 1,4-butanediol. Di- and polyols lead to glycidyl ethers. Dicarboxylic acids such as hexahydrophthalic acid are used for diglycide ester resins. Instead of a hydroxy group, the nitrogen atom of an amine or amide can be reacted with epichlorohydrin.
The other production route for epoxy resins is the conversion of aliphatic or cycloaliphatic alkenes with peracids:Kaiser, Wolfgang (2011) Kunststoffchemie für Ingenieure. Vol. 3. Hanser, Munich. pp. 437 ff. . In contrast to glycidyl-based epoxy resins, this production of such epoxy monomers does not require an acidic hydrogen atom but an aliphatic double bond.
Bisphenol-based
The most common epoxy resins are based on reacting epichlorohydrin (ECH) with bisphenol A, resulting in a different chemical substance known as bisphenol A diglycidyl ether (commonly known as BADGE or DGEBA). Bisphenol A-based resins are the most widely commercialised resins but also other bisphenols are analogously reacted with epichlorohydrin, for example Bisphenol F.
In this two-stage reaction, epichlorohydrin is first added to bisphenol A (bis(3-chloro-2-hydroxy-propoxy)bisphenol A is formed), then a bisepoxide is formed in a condensation reaction with a stoichiometric amount of sodium hydroxide. The chlorine atom is released as sodium chloride (NaCl) and the hydrogen atom as water.
Higher molecular weight diglycidyl ethers (n ≥ 1) are formed by the reaction of the bisphenol A diglycidyl ether formed with further bisphenol A; this is called prepolymerization.
A product comprising a few repeat units (n = 1 to 2) is a viscous, clear liquid; this is called a liquid epoxy resin. A product comprising more repeating units (n = 2 to 30) is at room temperature a colorless solid, which is correspondingly referred to as solid epoxy resin.
Instead of bisphenol A, other bisphenols (especially bisphenol F) or brominated bisphenols (e. g. tetrabromobisphenol A) can be used for the said epoxidation and prepolymerisation. Bisphenol F may undergo epoxy resin formation in a similar fashion to bisphenol A. These resins typically have lower viscosity and a higher mean epoxy content per gram than bisphenol A resins, which (once cured) gives them increased chemical resistance.
Increasing the ratio of bisphenol A to epichlorohydrin during manufacture produces higher molecular weight linear polyethers with glycidyl end groups, which are semi-solid to hard crystalline materials at room temperature depending on the molecular weight achieved. This route of synthesis is known as the "taffy" process. The usual route to higher molecular weight epoxy resins is to start with liquid epoxy resin (LER) and add a calculated amount of bisphenol A and then a catalyst is added and the reaction heated to circa . This process is known as "advancement".Hofer, Arnold; Schneider, Hildegard, and Siegenthaler, Nikolaus (1996) "Epoxy resin mixtures containing advancement catalysts", . As the molecular weight of the resin increases, the epoxide content reduces and the material behaves more and more like a thermoplastic. Very high molecular weight polycondensates (ca. 30,000–70,000 g/mol) form a class known as phenoxy resins and contain virtually no epoxide groups (since the terminal epoxy groups are insignificant compared to the total size of the molecule). These resins do however contain hydroxyl groups throughout the backbone, which may also undergo other cross-linking reactions, e.g. with aminoplasts, phenoplasts and isocyanates.
Epoxy resins are polymeric or semi-polymeric materials or an oligomer, and as such rarely exist as pure substances, since variable chain length results from the polymerisation reaction used to produce them. High purity grades can be produced for certain applications, e.g. using a distillation purification process. One downside of high purity liquid grades is their tendency to form crystalline solids due to their highly regular structure, which then require melting to enable processing.
An important criterion for epoxy resins is the Epoxy value which is connected to the epoxide group content. This is expressed as the "epoxide equivalent weight", which is the ratio between the molecular weight of the monomer and the number of epoxide groups. This parameter is used to calculate the mass of co-reactant (hardener) to use when curing epoxy resins. Epoxies are typically cured with stoichiometric or near-stoichiometric quantities of hardener to achieve the best physical properties.
Novolaks
Novolaks are produced by reacting phenol with methanal (formaldehyde). The reaction of epichlorohydrin and novolaks produces novolaks with glycidyl residues, such as epoxyphenol novolak (EPN) or epoxycresol novolak (ECN). These highly viscous to solid resins typically carry 2 to 6 epoxy groups per molecule. By curing, highly cross-linked polymers with high temperature and chemical resistance but low mechanical flexibility are formed due to the high functionality, and hence high crosslink density of these resins.
Aliphatic
There are two common types of aliphatic epoxy resins: those obtained by epoxidation of double bonds (cycloaliphatic epoxides and epoxidized vegetable oils) and those formed by reaction with epichlorohydrin (glycidyl ethers and esters).
Cycloaliphatic epoxides contain one or more aliphatic rings in the molecule on which the oxirane ring is contained (e.g. 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexane carboxylate). They are produced by the reaction of a cyclic alkene with a peracid (see above).Hammerton, L. (1996) Recent Developments in Epoxy Resins. Ed.: Rebecca Dolbey. RAPRA Review Reports. p. 8. . Cycloaliphatic epoxides are characterised by their aliphatic structure, high oxirane content and the absence of chlorine, which results in low viscosity and (once cured) good weather resistance, low dielectric constants and high Tg. However, aliphatic epoxy resins polymerize very slowly at room temperature, so higher temperatures and suitable accelerators are usually required. Because aliphatic epoxies have a lower electron density than aromatics, cycloaliphatic epoxies react less readily with nucleophiles than bisphenol A-based epoxy resins (which have aromatic ether groups). This means that conventional nucleophilic hardeners such as amines are hardly suitable for crosslinking. Cycloaliphatic epoxides are therefore usually homopolymerized thermally or UV-initiated in an electrophilic or cationic reaction. Due to the low dielectric constants and the absence of chlorine, cycloaliphatic epoxides are often used to encapsulate electronic systems, such as microchips or LEDs. They are also used for radiation-cured paints and varnishes. Due to their high price, however, their use has so far been limited to such applications.
Epoxidized vegetable oils are formed by epoxidation of unsaturated fatty acids by reaction with peracids. In this case, the peracids can also be formed in situ by reacting carboxylic acids with hydrogen peroxide. Compared with LERs (liquid epoxy resins) they have very low viscosities. If, however, they are used in larger proportions as reactive diluents, this often leads to reduced chemical and thermal resistance and to poorer mechanical properties of the cured epoxides. Large scale epoxidized vegetable oils such as epoxidized soy and lens oils are used to a large extent as secondary plasticizers and cost stabilizers for PVC.
Aliphatic glycidyl epoxy resins of low molar mass (mono-, bi- or polyfunctional) are formed by the reaction of epichlorohydrin with aliphatic alcohols or polyols (glycidyl ethers are formed) or with aliphatic carboxylic acids (glycidyl esters are formed). The reaction is carried out in the presence of a base such as sodium hydroxide, analogous to the formation of bisphenol A-diglycidyl ether. Also aliphatic glycidyl epoxy resins usually have a low viscosity compared to aromatic epoxy resins. They are therefore added to other epoxy resins as reactive diluents or as adhesion promoters. Epoxy resins made of (long-chain) polyols are also added to improve tensile strength and impact strength.
A related class is cycloaliphatic epoxy resin, which contains one or more cycloaliphatic rings in the molecule (e.g. 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate). This class also displays lower viscosity at room temperature, but offers significantly higher temperature resistance than the aliphatic epoxy diluents. However, reactivity is rather low compared to other classes of epoxy resin, and high temperature curing using suitable accelerators is normally required. As aromaticity is not present in these materials as it is in Bisphenol A and F resins, the UV stability is considerably improved.
Halogenated
Halogenated epoxy resins are admixed for special properties, in particular brominated and fluorinated epoxy resins are used.